Hitachi Chemical develops etchable SiN slurry for use in solar cells and other applications

Hitachi Chemical has introduced a novel silicon nitride (SiN) slurry that was showcased at the 12th International Nanotech 2013 event. This innovative slurry is designed to etch SiN selectively, and it is applied using a screen printing process. The key advantage is that only the SiN beneath the slurry gets removed, making it highly precise for targeted applications. The company aims to integrate this paste into solar cell production and MEMS manufacturing, where precision and efficiency are crucial. In traditional crystalline silicon solar cell fabrication, an anti-reflective SiN layer is typically deposited on the front side of the cell. After the silver (Ag) electrode is applied, a "Fire Through" process is used, where the electrode is fused with the silicon by heating it to several hundred degrees Celsius. This high-temperature step can sometimes cause stress or damage to the cell structure. With Hitachi Chemical’s new slurry, the need for the high-temperature Fire Through process is eliminated. Instead, the slurry is printed on the specific area to be etched using screen printing. It is then heated at 170°C for five minutes, during which time the slurry reacts to generate an etchant. This etchant selectively removes the SiN underneath without affecting other parts of the cell. Once the etching is complete, the slurry and the etched SiN can be rinsed away with water, leaving a clean surface ready for Ag electrode deposition. By removing the SiN in a controlled manner, the Ag electrode can now make direct contact with the silicon cell without relying on the traditional high-temperature process. This not only improves the reliability of the cell but also reduces energy consumption and potential damage during manufacturing. Currently, the slurry can be printed with a line width of approximately 100 micrometers, and it can etch SiN up to 100 nanometers deep. Looking ahead, Hitachi Chemical plans to further refine the technology to meet the evolving needs of solar cell manufacturers and other industries. Potential improvements include reducing the line width and increasing the etching depth, which could open up new possibilities in advanced semiconductor and photovoltaic applications.

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