Intel and Micron release new memory

Intel and Micron release new memory

128Gbit memory chip adopting new technology

Intel and Micron Technology announced on July 28, 2015 that they have developed the "3D XPoint technology," which Intel calls "a breakthrough that has been achieved more than 25 years since the adoption of NAND flash memory in 1989." The two companies have used this technology to develop chips with a capacity of 128 Gbits that are more common in NAND flash memory. It is expected to be mainly used to fill the "Storage-Class Memory" of the performance gap between DRAM and NAND flash memory.

According to the release document, 3D XPoint is a kind of non-volatile memory, but it does not disclose the principle of information recording. With a cross-point configuration in which word lines and bit lines are combined in a three-dimensional shape, selectors and memory cells are arranged at intersections of wires. This configuration, like a passive display, allows reading and writing of each memory cell without the use of a transistor.

In terms of performance, the two companies emphasized that in some respects they have reached 1,000 times the NAND flash memory. Specifically, the speed is 1000 times that of NAND flash, and the number of erasures is also 1000 times that of NAND flash. The density of memory cells is more than 10 times that of the prior art.

Phase Change Nonvolatile Memory

The publication does not clearly state what "speed" specifically refers to. If it is an access time at the time of writing, since the speed of the NAND flash memory is very slow in the storage technology, even if it is 1000 times, it will not exceed the existing non-volatile memory technology other than the DRAM and the NAND flash memory. .

In addition, the rewritable number of NAND flash memories is about 105 to 6 times, which is the lowest among various storage technologies. If the new product reaches 108 to 9 times its 1000 times, the reliability will be greatly improved. However, as a non-volatile memory technology, this performance is not particularly good.

The above performance values ​​and cross-point configurations are the closest to the non-volatile memory called "Phase Change Memory" (PCRAM, or PCM) in existing non-volatile memories. IBM and others are also advancing the development of three-dimensional PCRAM with cross-point configuration. (Reporter: Nozawa Tetsuo)

Titanium Parts include Pure Titanium Crucible,Pure Titanium Screw,Pure Titanium Springs and so on.


Titanium Grade 1-4 is pure Titanium, the other grades are alloys. Pure Titanium is used due to it's high corrosion resistance, the alloys because of the extremely high strength to weight ratio.

· Grade 1 Pure Titanium, relatively low strength and high ducility. Plate heat exchangers

· Grade 2 The pure titanium most used. The best combination of strength, ducility and weldability. Piping systems.

· Grade 3 High strength Titanium, used for Matrix-plates in shell and tube heat exchangers.

· Grade 5 The most manufactured titanium alloy. Exceedingly high strength. High heat resistance. Aerospace, subsea.

· Grade 7 Superior corrosion resistance in reducing and oxiding enviroments. Chemical Industry.

· Grade 9 Very high strength and corrosion resistance. Hydraulic piping, subsea.

· Grade 11 Applications as for gr 7. Suitable for deep drawing.

· Grade 12 Better heat resistance than pure Titanium. Applications as for grade 7 and 11. Shell and tube heat exchangers.

 

Titanium Parts

Titanium Parts,Pure Titanium Crucible,Pure Titanium Screw,Pure Titanium Springs

Baoji Shengyuan Metal Material Co., Ltd. , https://www.baojisymetal.com