Single crystal of barium ferrite is first integrated into silicon wafers

Researchers at North Carolina State University have made a breakthrough by successfully integrating a single-crystal material known as bismuth ferrite (BFO) onto a silicon wafer. This development marks a significant step toward the creation of next-generation smart devices that can sense, process, and respond to data more efficiently. BFO is unique because it exhibits both ferromagnetic and ferroelectric properties, allowing it to be magnetized by an electric current. These dual characteristics open up exciting possibilities for applications such as advanced magnetic storage systems, intelligent sensors, and spintronics. By embedding BFO as a single crystal on a silicon substrate, scientists were able to enhance its performance by reducing charge leakage between the BFO and the silicon base. The team discovered that when germanium ferrite crystals are grown epitaxially on silicon, they align well with LSMO electrodes. This compatibility allows the magnetic field of the ferrite to be turned off using as little as 4 volts—an important advancement, since this voltage level is compatible with existing integrated circuits. High voltages and strong magnetic fields are not only energy-intensive but can also cause damage or disrupt electronic functions. Therefore, this development paves the way for more efficient and reliable functional technologies. Additionally, the researchers found that even a weak external magnetic field can switch off the two poles of barium ferrite. Since this external field doesn't generate heat, it makes the material particularly suitable for applications where thermal management is critical. This could lead to improved performance in various electronic and computing systems. According to Jay Narayan, a professor of materials science and engineering at NC State, "This work means we are now capable of developing smart devices that can perform sensing, processing, and responding all on the same chip—without needing to transfer data elsewhere." This integration could significantly speed up data handling and reduce power consumption. The research was supported by the U.S. National Research Council and the Army Research Office. The findings were recently published in the online edition of *Nano Communications*.

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